CarboBond

about

Products of the CarboBond series are dual-component adhesives based on epoxy resin to which carbon nanoparticles are added to produce excellent electrical, thermal and mechanical properties. Variation of carbon composition and concentration allows fast and simple optimization for the particular purpose or application.
 
CarboBond is especially suitable for the kind of adhesive application where electrical conductivity is of primary importance, e.g.

  • current and heat conducting adhesion of CFP components,
  • thermal adhesives in electronics,
  • antistatic adhesives.

 

Properties

Characteristics: 

Products of the CarboBond series are notable especially for the following:

  • adaptable electrical and mechanical properties,
  • minimum specific electrical resistance about 100Ω∙cm,
  • good thermal conductivity,
  • very good adhesion,
  • adjustable viscosity.

CarboBond comes in different types for application by common methods (e.g. spraying, squeegee, silk screening).
 
The following CarboBond products are obtainable:

  • epoxy resin/amine (RT, warm hardening),
  • epoxy resin/anhydride (hot hardening).

Applications

Applications: 

CarboBond is especially suitable for the kind of adhesive application where electrical conductivity is of primary importance, e.g.

  • current and heat conducting adhesion of CFP components,
  • thermal adhesives in electronics,
  • antistatic adhesives.

Matching hardener systems are obtainable for CarboBond.

Downloads

Downloads: 

You'll receive more information by downloading these documents:
 

name
file format
download
CarboBond
PDF
Flyer_CarboBond_v01_01_EN.pdf